The recently uploaded video highlights the new design features of the Lakefield processor, and promises it will drive a whole new wave of “highly mobile devices” in incredibly thin and light form factors, with unprecedented power efficiency. The chip stacking technology is going to enable entire system-on-a-chip (SoC) designs that are smaller than a postage stamp. Sorry, that’s a rather archaic reference now… smaller than the nail on your index finger. People still have those, right?
Like the upcoming AMD Ryzen 3000 processors, the Lakefield setup is predicated on the use of chiplets to power the SoC. The Intel design, however, is stacking its processor using the Foveros packaging tech, so the GPU and CPU chiplets sit atop the I/O slice instead of being seated alongside it on the die, with the system memory layered on top of the lot.