AMD has shown off an early manufacturing sample of its desktop 3rd generation Ryzen processors. In a telling keynote over at CES 2019, AMD CEO Lisa Su showed off the latest 3rd generation Ryzen desktop chips in their full 7nm glory. These will be built on the denser process node, with at least eight-cores and 16 threads, and have already boasted Intel i9 9900K destroying performance.

So let’s get down to the details from the show. Shortly after announcing Radeon VII, a whole new gaming GPU set to launch February, AMD CEO Su offered up our first glimpse of the 3rd Gen Ryzen processors. These will be built on the same design principles initially shown off in its datacentre EPYC chips last year. That means an AMD Zen 2 modular chiplet design, featuring a 7nm processing chip and a 14nm I/O chip.

Su even gave us a quick glimpse under the hood, exposing the dual chiplet silicon. That eight-core, 16-thread chip is looking a little bare, however, and we reckon there’s just the right amount of space for another whole eight-core chiplet under that heat spreader. 16-cores anyone?